Diamond Wafer Dicing Blades
Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.Diamond Grit 3 to 70 micron,Minimum Dicing Blade Thickness .0003" (0.0076mm).
Nickel Bond Dicing Blades have a high diamond concentration and give a freer, faster cutting action with minimum heat generation. Diamonds have higher protrusion ratio, staying on the surface of the cut allowing for fast material removal. Electroplated Diamond Blades last less than metal bond, resin bond, hybrid bond blades and are the least expensive diamond blades available. Silicon wafer dicing is usually done with the plated diamond blade (hubbed or hubbless) which has proven most effective for this application. The Kerfs are typically in the 1-3 mil. range using a nominal spindle speed of 30,000 RPM with feed rates as high as 8 inch per sec.